E-Books
Yesterday, 16:37

Arthur H. Nilson, David Darwin , Charles Dolan, " Design of Concrete Structures"
McGraw Hill Higher Education; 13Rev Ed edition (October 1, 2003) | ISBN:0071232605 | 896 pages | PDF | 39 Mb
The twelfth edition of Design of Concrete Structures contains balanced coverage of important topics and is filled with applications that impart an "engineering" flavor, reflecting the authors' practical experience. This respected text leads the reader through a firm understanding of the behavior of reinforced concrete structure before it builds proficiency in the current methods of structural design practice. Particular reference is made to the American Concrete Institute Building Code, incorporating the 1995 ACI Code. --This text refers to an out of print or unavailable edition of this title. More

Arthur H. Nilson, David Darwin , Charles Dolan, " Design of Concrete Structures"
McGraw Hill Higher Education; 13Rev Ed edition (October 1, 2003) | ISBN:0071232605 | 896 pages | PDF | 39 Mb
The twelfth edition of Design of Concrete Structures contains balanced coverage of important topics and is filled with applications that impart an "engineering" flavor, reflecting the authors' practical experience. This respected text leads the reader through a firm understanding of the behavior of reinforced concrete structure before it builds proficiency in the current methods of structural design practice. Particular reference is made to the American Concrete Institute Building Code, incorporating the 1995 ACI Code. --This text refers to an out of print or unavailable edition of this title.
- 0 Views: 13
E-Books
Yesterday, 16:37

Rao Tummala, " Fundamentals of Microsystems Packaging"
McGraw-Hill Professional; 1 edition (May 8, 2001) | ISBN:0071371699 | 967 pages | PDF | 12 Mb
Written by Rao Tummala, the field’s leading author, Fundamentals of Microsystems Packaging is the only book to cover the field from wafer to systems, including every major contributing technology. This rigorous and thorough introduction to electronic packaging technologies gives you a solid grounding in microelectronics, photonics, RF, packaging design, assembly, reliability, testing, and manufacturing and its relevance to both semiconductors and systems. More

Rao Tummala, " Fundamentals of Microsystems Packaging"
McGraw-Hill Professional; 1 edition (May 8, 2001) | ISBN:0071371699 | 967 pages | PDF | 12 Mb
Written by Rao Tummala, the field’s leading author, Fundamentals of Microsystems Packaging is the only book to cover the field from wafer to systems, including every major contributing technology. This rigorous and thorough introduction to electronic packaging technologies gives you a solid grounding in microelectronics, photonics, RF, packaging design, assembly, reliability, testing, and manufacturing and its relevance to both semiconductors and systems.
- 0 Views: 11









